The JIIOV Advantage
AI-Driven Perceptual Interaction Foundation Model
JFingerTM Fingerprint Algorithm
- Massive data-driven, covering fingerprint features from different ages, regions, and skin tones.
- Lightweight mobile neural network design based on model lightweight technology.
- Deep learning throughout the pipeline, with better generalization and robustness than handcrafted-feature methods.
- Full process with multi-module decoupling, enabling independent, fast iteration of each module.
- Utilizes the latest Transformer technology and AIGC image production technology.
JF Image+ V2.5
Weak fingerprint signal enhancement based on deep learning can effectively deal with fingerprint signal extraction in difficult scenes such as dry, cold, and strong light.
JF Fast V5.0
Multi-level fingerprint feature extraction and comparison, simulating real user usage data for targeted optimization, achieving the highest unlocking pass rate and high fingerprint unlocking speed in the market, significantly improving the user unlocking experience.
JF Stitch V2.0
Significantly improves the unlocking rate of small-area fingerprints, and improves the user experience in difficult scenarios such as off-center pressing and light fingertip touch.
JF Safe V3.0
Comprehensive 2D/2.5D anti-fake ability, with official certifications from Google, Android, Alipay, and WeChat Pay (strong level).
Comprehensive R&D Capabilities
Professional Device Solution R&D Capability
A complete device design team with full optical design and packaging process evaluation capabilities, able to quickly provide customers with complete biometric design solutions.
Complete Chip-Level Application Solution Capability
Mature solution development capabilities, with optical under-display fingerprint and capacitive fingerprint solutions already in mass production with leading smartphone clients.
Excellent Engineering Capability
Well-established engineering implementation capability to ensure high-quality, high-yield, and stable mass production of products.
Comprehensive Quality Analysis Capability
Capability to carry out the whole process of fault analysis, reliability verification, material analysis, signal testing and etc.
Stable and Reliable Supply Chain Support
Chip Foundry
Strategic partnerships with multiple wafer manufacturers covering a range of processes from 8-inch to 12-inch wafers, 40nm to 180nm.
Semiconductor Optics
Multiple partnerships with filter film suppliers and semiconductor collimated structure partners, providing comprehensive semiconductor optical solutions.
Packaging and Testing
Equipped with resources for RW, CSP, LGA, and chip-level module packaging testing, covering top-tier packaging and testing manufacturers.
Module Manufacturers
Strong cooperative relationships with domestic module manufacturers with successful mass production experience.
Optical Lens
Long-term stable partnerships with top-tier domestic optical lens suppliers, ensuring mature and stable supply.
Robust Quality Control System
Quality and Environmental Management System
ISO9001 and ISO14001 certified.
Sustainable Procurement System
All materials, parts and components used are in compliance with RoHs , REACH and conflict-free minerals requirements.
Quality and Environmental Management Principles
Customer Orientation, Excellent Innovation
Prioritize Quality, Continuous Improvement
Honest & Law Abiding Green and Harmonious.
